COMPANY

Company profile

Company Name NAPSON CORPORATION
Established July, 1984
Capital Stock 50 Million Yen
President Makoto Nakamura
Major Products and Services Developing, manufacturing and selling measurement systems and software for silicon wafers/ingots and FPD process production
Office
Head Office

2-36-12, Kameido, Koto-ku, Tokyo 136-0071 Japan【Google maps】
TEL：+81-3-3636-0286 / FAX：+81-3-3636-0976

CHIBA R&D Center

2-5-10, Ohnodai, Midori-Ku, Chiba-City 267-0056 Japan【Google maps】
TEL：+81-43-205-5301 / FAX：+81-43-205-2331
Bank Reference
  • The Mizuho Bank Ltd. (Kameido Branch)
  • The Bank of Tokyo-Mitsubishi UFJ, Ltd. (Kameido Branch)
  • Sumitomo Mitsui Banking Corporation (Kameido Branch)
  • Chiba Bank Ltd. (Yawata Branch)

History

  • July. 1984
    Founded
  • Aug. 1986
    Succeeded in developing resistivity/sheet resistance mapping measuring system for Silicon wafers
  • Mar.1987
    Developed the sheet resistance measuring system for Flat Panel Display substrates
  • June.1988
    Made the agreement for the exclusive distribution in Korea & Taiwan with each local distributor
  • July.1988
    Founded the R&D Center in Chiba City
  • June.1989
    Succeeded in developing the cassette to cassette silicon wafer measuring system
  • Mar.1993
    Developed the non-contact resistivity measuring system [eddy-current method] for silicon wafers
  • Oct.1993
    Developed the fully automatic sheet resistance measuring system for Flat Panel Display substrates
  • May.1995
    Developed the fully automatic non-contact resistivity measuring system for silicon wafers
  • June.1998
    Moved and founded the new R&D Center in Ichihara City (ICHIHARA R&D Center)
  • Apr.2002
    Made the agreement for the exclusive distribution in EU, China & USA with each local distributor
  • May.2003
    Founded the second R&D Center in Chiba City (CHIBA R&D Center)
  • Apr.2004
    Developed the non-contact fully automatic sheet resistance measuring system for Flat Panel Display substrates
  • July.2004
    Founded Napson Korea Co., Ltd. in Seoul, Korea
  • Jan.2007
    Establishment a Joint Laboratory in Dalian University of Technology(China)
  • Dec.2007
    Developed the non-contact resistivity measuring instrument for Solar Cell silicon wafers
  • May.2008
    Became a certified company of [The 300 strongest small-medium sized enterprises : Ministry of Economy, Trade and Industry]
  • Dec.2010
    Extend the agreement of a Joint Laboratory in Dalian University of Technology(China) by Dec. 2012.
  • Jan.2014
    Developed the non-contact wafer flatness measurement instrument
  • Feb.2014
    Made the agreement for the exclusive distribution in Japan with LEMSYS
  • Aug.2016
    Made the agreement for the exclusive distribution in Japan with SCI(Scientific Computing International)

Sales Achievement

Sales Achievement (*Major customer)

ASAHI GLASS CO., LTD. Canon Inc.
Dai Nippon Printing Co., Ltd. FUJIFILM Corporation
Hitachi, Ltd. Honda Motor Co., Ltd.
Japan Display Inc. Kobe Steel,Ltd.
KYOCERA Corporation Mitsubishi Electric Corporation
Nichia Corporation Nikon Corporation
NIPPON STEEL & SUMITOMO METAL CORPORATION Panasonic Corporation
ROHM Co., Ltd. Sharp Corporation
Shin-Etsu Group (Shin-Etsu Chemical Co., Ltd., Shin-Etsu Semiconductor, Shin-Etsu Polymer etc) Sony Corporation
SUMCO Corporation Tokuyama Corporation
Toppan Printing Co., Ltd. TOSHIBA CORPORATION
Toray Industries, Inc. Toyota Motor Corporation
AIST [National Institute of Advanced Industrial Science and Technology] JST [Japan Science and Technology Agency]
NIMS [National Institute for Materials Science] Kyoto University
Tohoku University Tokyo University
Apple Inc. Applied Materials, Inc.
BASF SE E. I. du Pont de Nemours and Company
Honeywell International Inc. Infineon technologies AG
Intel Corporation OKMETIC OYJ
ON Semiconductor Robert Bosch GmbH
Saint-Gobain SA SunEdison Semiconductor, Ltd
Topsil Semiconductor Materials A/S Vishay Intertechnology, Inc.
X-FAB Semiconductor Foundries AG Fraunhofer-Gesellschaft
IEMN [Institut d’Electronique, de Microélectronique et de Nanotechnologie] ISFH [Institut für Solarenergieforschung Hameln]
LETI [Laboratoire d’électronique des technologies de l’information] AU Optronics Corp.
BOE Co,Ltd. CSOT CORPORATION [China Star Optoelectronics Technology]
Delta Electronics, Inc. EPISTAR Corporation
Foxconn Technology Group. (Innolux Corporation, Century Display) Hangzhou Haina semiconductor Co.,Ltd.
Motech Industries, Inc. Neo Solar Power Corporation
SF-PV(Shunfeng Photovoltaic International Limited) Shanghai Sinyang Semiconductor Material Co., Ltd
Suntech Power Tianma Micro-electronics Co.
TPK Holding Co., Ltd Wafer Works Corporation
Xi’an LONGI Silicon Materials Corp. Harbin Institute of Technology
DONGWOO FINE-CHEM Hanwha Chemical Corporation
Hyundai Heavy Industries LG Group [LG Siltron Inc., LG Chem Ltd, LG Display Co., Ltd, LG Electronics Incorporated etc]
Samsung Group [Samsung Electronics Co., Ltd, Samsung Display Co.,Ltd., Samsung SDI etc] KIST(Korea Institute of Science & Technology)
Seoul National Univ