Measures Thickness, TTV, Bow, Warp and site and global Flatness (ASTM compliance)
Measures all materials including Si, GaAs, Ge, InP, SiC
Full 500 micron thickness measurement range without re-calibration
2-D /3-D Mapping software
Thickness: 200 –1200μm
Bow : +/-350μm
Wafer flatness sorting system : NC-2000(Robotic carrier), NC-6800(Belt carrier)
*Adding Resisitivity measurement module and/or PN checker module system is also available.